| PART |
Description |
Maker |
| MM3Z10VS |
Planar Die Construction
|
TY Semiconductor Co., L...
|
| BZT52C5V1 BZT52C43 |
Planar Die Construction
|
SHENZHEN YONGERJIA INDU...
|
| MMBZ5221B |
Planar Die Construction
|
SK Electronics
|
| MMBZ5228B |
Planar Die Construction
|
TY Semiconductor Co., L...
|
| MMSTA13 |
Epitaxial Planar Die Construction
|
TY Semiconductor Co., Ltd
|
| BZT52C30 BZT52C9V1 BZT52C5V1 |
1/2 Watt ZEBER DIODES Planar Die Construction
|
First Components International
First Components Intern...
|
| SAC7.0 SAC12 |
Glass Passivated Die Construction
|
Shanghai Semitech Semic...
|
| MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co., Ltd...
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| SL5250 SL5228 SL5248 SL5259 SL5258 SL5251 SL5252 S |
SILICON PLANAR ZENER DIODES/ 500mW/MINIMELF PACKAGE
SILICON PLANAR ZENER DIODES 500mWMINIMELF PACKAGE
SILICON PLANAR ZENER DIODES, 500mW,MINIMELF PACKAGE
|
SURGE[Surge Components]
|
| TIP112 |
EPITAXIAL PLANAR NPN TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|
